IMARC Group, a leading market research company, has recently releases report titled Thermal Management Technologies Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2023-2028 The study provides a detailed analysis of the industry, including the global thermal management technologies market share, size, trends and growth forecasts. The report also includes competitor and regional analysis and highlights the latest advancements in the market.
Report Highlights
How big is the thermal management technologies market?
Report Attributes | Details |
Market Size in 2022 | US$ 12.7 Billion |
Market Forecast in 2028 | US$ 20.0 Billion |
Growth rate (2023 to 2028) | CAGR of 7.79% |
Base Year of the Analysis | 2022 |
Forecast Period | 2023-2028 |
What is thermal management technologies?
Thermal management technologies aid in monitoring and managing excess heat from electrical devices and circuitry. They work by using various substrates within electronic devices to enable efficient heat dissipation. They also assist in preventing system failures and extending the operational life of the equipment. As a result, thermal management technologies find extensive applications in the conduction, convection, advanced, and hybrid cooling systems of consumer electronics, servers, and data centers during installation and calibration.
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What are the growth prospects and trends in the thermal management technologies?
The global thermal management technologies market is primarily driven by its increasing applications across the automotive, defense, aerospace, and telecommunication industries. For instance, in the electronics and electrical sectors, there is a rise in the demand for thermal management technologies for minimizing the high heat flux produced by miniaturized devices with enhanced power densities. Besides this, the surging product adoption in automobiles and electric and hybrid vehicles represents another major growth-inducing factor.
Additionally, the leading players are introducing innovative solutions, such as jet impingement mechanisms, cold plates, heat vapor chambers, and cool chips, which are widely used as active cooling agents and are integrated with micro fluids and multi-phase heat transfer technologies for better thermal resistance and performance of computers and other power-intensive devices. This, in turn, is creating a favorable outlook for the market owing to the inflating sales of consumer electronics. Furthermore, the escalating demand for efficient heat dissipation solutions, rising adoption of renewable energy sources, and continual technological advancements are also anticipated to propel the market growth in the coming years.
What is included in market segmentation?
The report has segmented the market into the following categories:
Breakup by Product:
- Hardware
- Software
- Interface
- Substrates
Breakup by Application:
- Computers
- Consumer Electronics
- Telecommunications
- Automotive
- Renewable Energy
- Others
Breakup by Geography:
- North America (United States, Canada)
- Asia Pacific (China, Japan, India, South Korea, Australia, Indonesia, Others)
- Europe (Germany, France, United Kingdom, Italy, Spain, Russia, Others)
- Latin America (Brazil, Mexico, Others)
- Middle East and Africa
Who are the key players operating in the industry?
The report covers the major market players including:
- Advanced Cooling Technologies Inc.
- Autoneum Holding AG
- Gentherm Inc., Heatex Inc. (Madison Industries)
- Henkel AG Co. KGaA
- Honeywell International Inc.
- Laird Thermal Systems Inc.
- Momentive Performance Materials Inc.
- Parker-Hannifin Corp.
- Thermal Management Technologies.
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